Description

In this project, the Cooling of an IGBT Heat Sink is simulated by ANSYS Fluent software. We perform this CFD project and investigate it by CFD analysis.

An insulated-gate bipolar transistor (IGBT) is a three-terminal power semiconductor device primarily used as an electronic switch. An IGBT generates significant heat and can be affected by excess thermal energy.

Using air cooling or liquid cooling techniques, e.g. heat sinks, this excessive heat can be removed, which can lead to improved performances, thus enabling much higher power densities and more compact modules.

The heat sink is in contact with a heat source (with the heat flux of 14583 W/m2) on one side and the air flows on the other side with a mass flow of 0.25Kg/s. The airflow is responsible for cooling the heat sink.

The geometry for analyzing this simulation consists of a heat source and a heat sink. The geometry is designed and meshed in Gambit®.

The mesh type used for this geometry is unstructured and the element number is 11872367.

IGBT Methodology

The Energy Equation is activated to analyze the heat transfer rate and the Laminar viscous model is activated to solve the airflow.

IGBT Conclusion

At the end of the solution, we present contours of temperature, velocity, surface heat flux, and Nu number. The contours show that the cold flow of the fluid has been able to lower the temperature of the heatsink.

In fact, in the temperature exchange caused by the cold flow of fluid and heat source, the temperature of the whole set has dropped and the purpose of this project has been met.