The Chip & Component: Electronics Cooling All Levels Training Package is a focused 7-project path for cooling electronic components in ANSYS Fluent, from basic heat sinks and IGBT power modules to microchannel and immersion cooling. It is built for students, engineers, and researchers who want to model how chips, power modules, and circuit boards shed heat, starting with your first heat sink and ending with advanced immersion cooling.

Heat sink fundamentals and power electronics: Start with heat sink cooling and the energy equation. Then apply the same principles to an IGBT heat sink, a real power-electronics component.

Microchannel heat sinks: Analyze heat transfer enhancement in a microchannel heat sink with water flow, and conjugate heat transfer between the solid and the fluid in a microchannel heat sink.

Heat sink design comparison: Compare pin and plate heat sink performance.

Immersion cooling: Model two-phase cooling of a submerged PCB, then study the effect of immersion cooling on a heat sink’s performance.

What’s included:

• 7 step-by-step ANSYS Fluent projects, from basic heat sink cooling to immersion cooling

• Nearly 2 hours of video lessons with English audio

• Projects across beginner, intermediate, and advanced levels

• Backed by 15 years of MR CFD simulation expertise

Looking for heat sink design in greater depth? The Heat Sink: Electronics Cooling All Levels Training Package adds porous media, aluminum foam, nanofluids, and DOE optimization.

Whether you’re preparing a thesis, designing a cooling solution for electronics, or building in-house CFD skills, this package gives you a structured path from your first heat sink simulation to advanced component cooling.