The Heat Sink: Electronics Cooling All Levels Training Package is MR CFD’s complete path into heat sink and electronics cooling simulation in ANSYS Fluent, with 10 hands-on projects and nearly 3 hours of video lessons. It is built for students, engineers, and researchers who want to model real electronics cooling, from your first heat sink setup to advanced enhancement and optimization techniques.

Fundamentals and power electronics: Start with heat sink cooling by forced convection, covering geometry, mesh, energy equation, turbulence modeling, and temperature and flow results. Then apply the same principles to an IGBT heat sink, a real power-electronics component.

Porous media: Model a heat sink with a porous medium, then validate a non-equilibrium porous aluminum foam heat sink against a published paper.

Microchannel heat sinks: Analyze conjugate heat transfer in a microchannel heat sink and heat transfer enhancement in a microchannel heat sink. Finish with microchannel optimization using DOE and the LHSD method.

Advanced cooling strategies: Study the effect of immersion cooling on heat sink performance, compare water with TiO₂, SiO₂, and Fe₃O₄ nanofluids, and evaluate pin and plate heat sink performance.

What’s included:

• 10 step-by-step ANSYS Fluent projects, including a paper-validation case

• Nearly 3 hours of video lessons

• English audio with subtitles in English, Spanish, Arabic, Turkish, French, and Portuguese

• Projects across beginner, intermediate, and advanced levels

• Backed by 15 years of MR CFD simulation expertise

Whether you’re preparing a research paper, designing a cooling solution for electronics, or building in-house CFD skills, this package gives you a structured path from first heat sink simulation to advanced thermal analysis.