Heat Sink Online Courses

Price: $399

The Heat Sink: Electronics Cooling All Levels Training Package delivers 10 hands-on ANSYS Fluent projects, taking students, engineers, and researchers from basic heat sink cooling to advanced thermal management. It covers forced convection cooling, IGBT power electronics, porous media and non-equilibrium aluminum foam with paper validation, microchannel heat sinks with conjugate heat transfer and DOE optimization, immersion cooling, water-based nanofluids (TiO₂, SiO₂, Fe₃O₄), and pin and plate heat sink comparison. Includes nearly 3 hours of step-by-step video lessons, English audio with subtitles in six languages, and 15 years of MR CFD expertise for a confident start in electronics cooling CFD.

Price: $63

This project presents a numerical study of heat transfer in a heat sink using ANSYS Fluent. Four cases were simulated, including pure water (single-phase) and three nanofluids (water mixed with TiO₂, SiO₂, and Fe₃O₄) using the mixture multiphase model. The geometry was created in ANSYS DesignModeler, and a high-quality mesh of about 1.6 million elements was generated. A pressure-based, steady-state solver with the SIMPLE algorithm was applied. The results, illustrated in contour plots of velocity and temperature, show that nanofluids enhance cooling efficiency compared to pure water. Among the tested fluids, the Fe₃O₄–water mixture demonstrated the best thermal performance at the fins and base plate, highlighting its potential for advanced heat sink applications

Price: $96

This product presents Microchannel Heat Sink Optimization using ANSYS software. We model with the Design Modeler software; we mesh with ANSYS Meshing software. We use the Design Exploration tool to perform the optimization process. We use the Latin Hypercube Sampling Design in the Design of Experiment (DOE). We use the Genetic Aggregation and the Response Surface Methodology (RSM).

Price: $8

Simulate forced convective cooling of a heat sink to dissipate 100 W of thermal power from a CPU with silicone thermal paste. Copper plate, silicone thermal paste, and aluminum heat sink with seven fins. Forced air flow at 7 m/s removes thermal energy through convection. CFD simulation using the k-ω SST turbulence model in ANSYS Fluent. The model was designed in Design Modeler for simulation. The simulation uses 1,477,676 mesh elements in Fluent Meshing for accuracy. Heat sink assembly ensures efficient cooling and maintains safe operating temperatures for the CPU.

Price: $14

This study compares the thermal performance of open and enclosed heat sink designs using CFD simulations The open design features exposed fins, while the enclosed design has a closed-top 3-D symmetry model designed using ANSYS Design Modeler software model meshed with ANSYS Meshing software, and the element number equals 2,599,334. The discrete Ordinates (DO) radiation model was activated to simulate the impact of solar irradiation

Price: $8

This project investigates the thermal performance enhancement of a heat sink through CFD analysis in ANSYS Fluent. The study focuses on a heat sink design featuring cylindrical pin fins with splitter plates. The geometry was designed in ANSYS Design Modeler and meshed using ANSYS Meshing, resulting in a structured mesh of 804,434 elements. The study demonstrates the impact of splitter plates on flow patterns and heat transfer, potentially improving overall cooling efficiency.

Price: $6

This project simulates the effect of immersion cooling on heat sinks' performance in ANSYS Fluent software. The 3D model is designed using the Spaceclaim, then meshed using ANSYS Meshing producing 85,000 cells. The k-epsilon RNG turbulence model is employed to accurately predict flow patterns.

Price: $8

The problem numerically simulates a Microchannel Heat Sink in ANSYS Fluent software investigating heat transfer and temperature distribution. The geometry of the model is created using SpaceClaim software. The model is meshed in ANSYS Meshing, creating a structured mesh with 440,000 elements.

Price: $120

The present simulation is about Pin and Plate Heatsink Heat Transfer by ANSYS Fluent, and the results of this simulation have been analyzed.