The Electronic Cooling: Beginner Level Training Package is a focused 10-project path for getting started with electronics cooling in ANSYS Fluent, from a basic heat sink to server room and data center cooling. It is built for students, engineers, and researchers who are new to thermal management of electronics and want to learn how heat is removed at both the component and the room scale, starting with your first heat sink and ending with cooling of a data center.

Heat sink fundamentals: Start with heat sink cooling. Then apply the same principles to an IGBT heat sink, and study the effect of immersion cooling on a heat sink’s performance.

Microchannel cooling: Analyze heat transfer enhancement in a microchannel heat sink, simulate a microchannel with a heat source, and model conjugate heat transfer in a microchannel heat sink.

Server rooms and data centers: Model cooling of a server room with 6 cabinets, then simulate cooling of a data center.

Equipment room ventilation: Simulate ventilation of a miner room and of a storage container room.

What’s included:

• 10 step-by-step ANSYS Fluent projects, from basic heat sink cooling to data center cooling

• Over 2.5 hours of video lessons with English audio

• Beginner-level projects that build the core skills of electronics cooling simulation

• Backed by 15 years of MR CFD simulation expertise

Looking for heat sink design in greater depth? The Heat Sink: Electronics Cooling Training Package adds porous media, aluminum foam, and nanofluids.

Whether you’re preparing a thesis, starting your first electronics cooling project, or building in-house CFD skills, this package gives you a structured path from your first heat sink simulation to room-scale cooling.