Electronic Cooling Online Courses

Price: $119

The Generator & Machinery Room: Electronics Cooling Training Package is a focused 5-project path for ventilation and cooling of power equipment rooms, from a generator room to a ship engine room. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering generator room ventilation with fans, transformer room ventilation, storage container room ventilation, a ship engine room ventilation system, and airflow through the impeller of an electrical motor. Includes over 1 hour of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For cooling of IT spaces, with data centers, server rooms, and computer rooms, see the Data Center & Server Room: Electronics Cooling Training Package.

Price: $1,109

The Battery: Electronics Cooling Training Package is a focused 5-project path for battery thermal management, from PCM cooling of a battery to cold plate cooling of a full battery pack. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering battery cooling with phase change materials, a paper-validated lithium-ion PCM case, nanofluid cooling, a battery pack with a cold plate, and water vapor cooling. Includes over 1.5 hours of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For battery electrochemical modeling, see the Battery Model: Beginner Level Training Package.

Price: $129

The Microchannel: Electronics Cooling Training Package is a focused 5-project path for microchannel cooling of electronics, from a basic microchannel heat sink to nanofluid flow and DOE optimization. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering microchannel heat transfer enhancement, a microchannel heat source, conjugate heat transfer in a microchannel heat sink, multiphase nanofluid flow in a minichannel, and microchannel heat sink optimization with the LHSD method. Includes over 1 hour of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For broader heat sink design, with porous media, aluminum foam, IGBT modules, and immersion cooling, see the Heat Sink: Electronics Cooling Training Package.

Price: $269

The Data Center & Server Room: Electronics Cooling Training Package is a focused 7-project path for room-scale electronics cooling, from a paper-validated data center model to miner room ventilation. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering data center thermal performance, HVAC and thermal management, data center cooling, a server room with 6 cabinets, computer room air conditioning with DPM, radiation heat transfer, and miner room ventilation. Includes over 2.5 hours of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For cooling at the component level, with heat sinks, IGBT modules, microchannels, and immersion cooling, see the Chip & Component: Electronics Cooling All Levels Training Package.

Price: $179

The Chip & Component: Electronics Cooling All Levels Training Package is a focused 7-project path for cooling electronic components, from basic heat sinks and IGBT power modules to microchannel and immersion cooling. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering heat sink cooling, IGBT power modules, microchannel heat sinks with conjugate heat transfer, pin and plate heat sink comparison, and PCB and heat sink immersion cooling. Includes nearly 2 hours of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For heat sink design in greater depth, with porous media, nanofluids, and optimization, see the Heat Sink: Electronics Cooling All Levels Training Package.

Price: $289

The Heat Sink: Electronics Cooling All Levels Training Package delivers 10 hands-on ANSYS Fluent projects, taking students, engineers, and researchers from basic heat sink cooling to advanced thermal management. It covers forced convection cooling, IGBT power electronics, porous media and non-equilibrium aluminum foam with paper validation, microchannel heat sinks with conjugate heat transfer and DOE optimization, immersion cooling, water-based nanofluids (TiO₂, SiO₂, Fe₃O₄), and pin and plate heat sink comparison. Includes nearly 3 hours of step-by-step video lessons, English audio with subtitles in six languages, and 15 years of MR CFD expertise for a confident start in electronics cooling CFD.