The Microchannel: Electronics Cooling Training Package is a focused 5-project path for microchannel cooling of electronics in ANSYS Fluent, from a basic microchannel heat sink to nanofluid flow and DOE optimization. It is built for students, engineers, and researchers who want to model how flow through small channels removes high heat fluxes from compact devices, starting with your first microchannel simulation and ending with an optimized heat sink design.

Microchannel fundamentals: Start with heat transfer enhancement in a microchannel heat sink. Then simulate a microchannel with a heat source.

Conjugate heat transfer: Analyze conjugate heat transfer between the solid and the fluid in a microchannel heat sink.

Nanofluid cooling: Model multiphase nanofluid flow inside a minichannel.

Design optimization: Optimize a microchannel heat sink with Design of Experiments (DOE), applying the Latin Hypercube Sampling Design (LHSD) method.

What’s included:

• 5 step-by-step ANSYS Fluent projects, from a basic microchannel heat sink to DOE optimization

• Over 1 hour of video lessons with English audio

• Projects across beginner, intermediate, and advanced levels

• Backed by 15 years of MR CFD simulation expertise

Looking for broader heat sink design? The Heat Sink: Electronics Cooling Training Package adds porous media, aluminum foam, IGBT cooling, and immersion cooling.

Whether you’re preparing a thesis, designing a compact cooling solution for high-power electronics, or building in-house CFD skills, this package gives you a structured path from your first microchannel simulation to an optimized microchannel heat sink.