Electronic Cooling Golden Training Package
Price:
$8,784
$1,789
The Electronic Cooling GOLDEN Training Package delivers over 50 ANSYS Fluent tutorials, transforming teams into experts with instant project readiness. Tailored for professors, CEOs, and firms, it covers heat sinks and chip cooling, IGBT modules, microchannel heat sinks, nanofluids, porous media and aluminum foam, immersion cooling, heat pipes and thermosyphons, battery thermal management with PCM, cold plates, and cooling channels, data centers, server and computer rooms, miner rooms, generator, transformer, and machinery room ventilation, DOE optimization, and paper-validated cases. Includes step-by-step exercises, 1-year support, 3-month HPC, lifetime updates, and 15 years of MR CFD expertise for stress-free onboarding and competitive edge.
Electronic Cooling Golden Training Package
Price:
$8,784
$1,789
The Electronic Cooling GOLDEN Training Package delivers over 50 ANSYS Fluent tutorials, transforming teams into experts with instant project readiness. Tailored for professors, CEOs, and firms, it covers heat sinks and chip cooling, IGBT modules, microchannel heat sinks, nanofluids, porous media and aluminum foam, immersion cooling, heat pipes and thermosyphons, battery thermal management with PCM, cold plates, and cooling channels, data centers, server and computer rooms, miner rooms, generator, transformer, and machinery room ventilation, DOE optimization, and paper-validated cases. Includes step-by-step exercises, 1-year support, 3-month HPC, lifetime updates, and 15 years of MR CFD expertise for stress-free onboarding and competitive edge.
Price: $16
The problem numerically simulates the heat transfer of water flow inside a microchannel heat sink using ANSYS Fluent software. We design the 3-D model with the Design Modeler software. We mesh the model with ANSYS Meshing software. The mesh type is Structured, and the element number equals 1500000. The Energy Equation is activated to consider heat transfer.
Price: $16
The problem numerically simulates Server Room Cooling with 6 Cabinets using ANSYS Fluent software. We design the 3-D model by the Design Modeler software. We Mesh the model by ANSYS Meshing software, and the element number equals 448000. The Energy Equation is activated, and a Heat Source is applied to the room.
Price: $39
The problem numerically simulates the battery cooling by applying phase change material in a storage tank using ANSYS Fluent software. We design the 3-D model by the Design Modeler software. The present simulation is performed in two steps: without and with phase change material on both sides of the battery. We mesh the model with ANSYS Meshing software. The mesh type is Structured, and the element number equals 93090 and 276660 for the first and the second cases, respectively. We perform this simulation as unsteady (Transient). We use the Solidification and Melting model to define phase change materials.
Radiation Heat Transfer in a Computer Room
Intermediate
Price: $24
The problem numerically simulates the air conditioning of a computer room containing four computers using ANSYS Fluent software. We design the 3-D model with the Design Modeler software. We mesh the model with ANSYS Meshing software, and the element number equals 809037. We use the Surface to Surface (S2S) model to define the Radiation model. We use the ideal gas model to consider buoyancy force.
Price: $16
The problem numerically simulates Storage Container Room Ventilation using ANSYS Fluent software. We design the 3-D model by the Design Modeler software. We mesh the model with ANSYS Meshing software. The mesh type is Structured, and the element number equals 115635. The Energy Equation is activated to consider heat transfer.
Price: $16
The problem numerically simulates the Microchannel Heat Source using ANSYS Fluent software. We design the 3-D model by the Design Modeler software. We mesh the model with ANSYS Meshing software. The mesh type is Structured, and the element number equals 1500000. The Energy Equation is activated to consider heat transfer.
Price: $42
The problem numerically simulates Transformer Room Ventilation using ANSYS Fluent software. We design the 3-D model by the Design Modeler software. We mesh the model with ANSYS Meshing software, and the element number equals 592411. We use the Heat Source and Porous Medium to consider their effect on heat transfer.
Generator Room Ventilation Applying Fans, ANSYS Fluent CFD Simulation Tutorial
Beginner, Intermediate
Price: $42
The problem numerically simulates Generator Room Ventilation Applying Fans using ANSYS Fluent software. We design the 3-D model by the Design Modeler software. We Mesh the model by ANSYS Meshing software, and the element number equals 3854957. Several small and large fans are placed inside the generator room to investigate their effect on heat transfer.
Non-Equilibrium Porous Aluminum Foam Heat Sink, Paper Validation
Intermediate, Advanced
Price: $84
The problem numerically simulates Non-Equilibrium Porous Aluminum Foam Heat Sink using ANSYS Fluent software. We design the 3-D model with the Design Modeler software. We Mesh the model with ANSYS Meshing software. The mesh type is Structured, and the element number equals 87000. This project is simulated and validated with a reference article. We use a Porous medium made of aluminum foam.
The Electronic Cooling GOLDEN Training Package is MR CFD’s most complete ANSYS Fluent collection for thermal management of electronics, with over 40 hands-on tutorials that take you from a first heat sink model to advanced, publication-level analysis. Built for professors, CEOs, research teams, and engineering firms, it gives your group a ready-to-use project library, so new members become productive quickly and ongoing work starts from proven templates.
Heat sinks and chip cooling: Simulate basic heat sink cooling, an IGBT heat sink, and a CPU with silicone thermal paste. Study the impact of geometry, splitter plates on pin fin heat sinks, and pin and plate heat sink comparison. Add a porous-medium heat sink, a non-equilibrium porous aluminum foam heat sink with paper validation, and heat sink cooling with water and TiO₂, SiO₂, and Fe₃O₄ nanofluids.
Microchannel cooling: Analyze heat transfer enhancement and conjugate heat transfer in microchannel heat sinks, a microchannel heat source, multiphase nanofluid flow in a minichannel, and two-phase flow boiling of methanol in a heated micro-channel. Optimize a microchannel heat sink with Design of Experiments (DOE) using the Latin Hypercube Sampling Design (LHSD) method.
Immersion cooling and heat pipes: Model submerge cooling of a printed circuit board (PCB), the effect of immersion cooling on heat sink performance, and liquid immersion cooling of an ASIC miner. Simulate a thermosyphon heat pipe with the VOF multiphase model, and evaporation and condensation in a heat pipe.
Battery thermal management: Study battery cooling with PCM, nanofluid, and water vapor. Model battery modules with cooling channels and a cooling plate, and a battery pack with a cold plate. Work through a 1P1S battery with a PCM cover and a lithium-ion battery cooled with PCM, both validated against papers.
Data centers, server and computer rooms: Reproduce a data center thermal performance study with paper validation, and model data center HVAC and thermal management, data center cooling, and a server room with 6 cabinets. Add computer room air conditioning with DPM, radiation heat transfer in a computer room, and miner room ventilation.
Generator and machinery rooms: Simulate generator room ventilation in an industrial application and with fans, transformer room ventilation, and storage container room ventilation. Evaluate the impact of ventilation on temperature and humidity in a turbine hall, and the ventilation system of a ship engine room.
What’s included:
Step-by-step exercises with complete setup, meshing, solving, and post-processing
Projects spanning beginner, intermediate, and advanced levels, including paper-validation cases
1-year technical support
3-month HPC access
Lifetime updates
Backed by 15 years of MR CFD simulation expertise
Whether you’re preparing a research paper, designing cooling for chips, batteries, or data centers, or building in-house CFD capability, this package gives you the knowledge, tools, and confidence to deliver faster and stay ahead of the competition.