Electronic Cooling Golden Training Package
Price:
$8,784
$1,789
The Electronic Cooling GOLDEN Training Package delivers over 50 ANSYS Fluent tutorials, transforming teams into experts with instant project readiness. Tailored for professors, CEOs, and firms, it covers heat sinks and chip cooling, IGBT modules, microchannel heat sinks, nanofluids, porous media and aluminum foam, immersion cooling, heat pipes and thermosyphons, battery thermal management with PCM, cold plates, and cooling channels, data centers, server and computer rooms, miner rooms, generator, transformer, and machinery room ventilation, DOE optimization, and paper-validated cases. Includes step-by-step exercises, 1-year support, 3-month HPC, lifetime updates, and 15 years of MR CFD expertise for stress-free onboarding and competitive edge.
Electronic Cooling Golden Training Package
Price:
$8,784
$1,789
The Electronic Cooling GOLDEN Training Package delivers over 50 ANSYS Fluent tutorials, transforming teams into experts with instant project readiness. Tailored for professors, CEOs, and firms, it covers heat sinks and chip cooling, IGBT modules, microchannel heat sinks, nanofluids, porous media and aluminum foam, immersion cooling, heat pipes and thermosyphons, battery thermal management with PCM, cold plates, and cooling channels, data centers, server and computer rooms, miner rooms, generator, transformer, and machinery room ventilation, DOE optimization, and paper-validated cases. Includes step-by-step exercises, 1-year support, 3-month HPC, lifetime updates, and 15 years of MR CFD expertise for stress-free onboarding and competitive edge.
Price: $729
The Electronic Cooling: Advanced Level Training Package is a focused 10-project path for advanced electronics cooling, from nanofluid and aluminum foam heat sinks to paper-validated data center and battery models. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering heat sink cooling with water and nanofluids, a non-equilibrium porous aluminum foam heat sink, pin and plate heat sink comparison, a thermosyphon heat pipe with the VOF model, microchannel heat sink optimization with DOE, data center HVAC and thermal management, a paper-validated data center thermal performance study, computer room air conditioning with DPM, a battery pack with a cold plate, and a paper-validated lithium-ion battery cooled with PCM. Includes nearly 4 hours of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. To build up to this level first, see the Electronic Cooling: Intermediate Level Training Package.
Price: $229
The Electronic Cooling: Intermediate Level Training Package is a focused 10-project path for building on the basics of electronics cooling, from a porous-medium heat sink to battery thermal management and equipment room ventilation. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering heat sink cooling with a porous medium, heat pipe evaporation and condensation, PCB submerge cooling, multiphase nanofluid flow in a minichannel, battery cooling with PCM and with water vapor, radiation heat transfer in a computer room, generator room ventilation with fans, transformer room ventilation, and a ship engine room ventilation system. Includes over 2.5 hours of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. To start with the fundamentals first, see the Electronic Cooling: Beginner Level Training Package.
Price: $109
The Electronic Cooling: Beginner Level Training Package is a focused 10-project path for getting started with electronics cooling, from a basic heat sink to server room and data center cooling. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering heat sink cooling, an IGBT heat sink, immersion cooling of a heat sink, microchannel heat transfer enhancement, a microchannel heat source, conjugate heat transfer in a microchannel heat sink, a server room with 6 cabinets, data center cooling, miner room ventilation, and storage container room ventilation. Includes over 2.5 hours of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For heat sink design in greater depth, with porous media, aluminum foam, and nanofluids, see the Heat Sink: Electronics Cooling Training Package.
Generator & Machinery Room: Electronics Cooling Training Package
Beginner, Intermediate, Advanced
Price: $119
The Generator & Machinery Room: Electronics Cooling Training Package is a focused 5-project path for ventilation and cooling of power equipment rooms, from a generator room to a ship engine room. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering generator room ventilation with fans, transformer room ventilation, storage container room ventilation, a ship engine room ventilation system, and airflow through the impeller of an electrical motor. Includes over 1 hour of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For cooling of IT spaces, with data centers, server rooms, and computer rooms, see the Data Center & Server Room: Electronics Cooling Training Package.
Battery: Electronics Cooling Training Package
Beginner, Intermediate, Advanced
Price: $1,109
The Battery: Electronics Cooling Training Package is a focused 5-project path for battery thermal management, from PCM cooling of a battery to cold plate cooling of a full battery pack. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering battery cooling with phase change materials, a paper-validated lithium-ion PCM case, nanofluid cooling, a battery pack with a cold plate, and water vapor cooling. Includes over 1.5 hours of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For battery electrochemical modeling, see the Battery Model: Beginner Level Training Package.
Microchannel: Electronics Cooling Training Package
Beginner, Intermediate, Advanced
Price: $129
The Microchannel: Electronics Cooling Training Package is a focused 5-project path for microchannel cooling of electronics, from a basic microchannel heat sink to nanofluid flow and DOE optimization. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering microchannel heat transfer enhancement, a microchannel heat source, conjugate heat transfer in a microchannel heat sink, multiphase nanofluid flow in a minichannel, and microchannel heat sink optimization with the LHSD method. Includes over 1 hour of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For broader heat sink design, with porous media, aluminum foam, IGBT modules, and immersion cooling, see the Heat Sink: Electronics Cooling Training Package.
Data Center & Server Room: Electronics Cooling Training Package
Beginner, Intermediate, Advanced
Price: $269
The Data Center & Server Room: Electronics Cooling Training Package is a focused 7-project path for room-scale electronics cooling, from a paper-validated data center model to miner room ventilation. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering data center thermal performance, HVAC and thermal management, data center cooling, a server room with 6 cabinets, computer room air conditioning with DPM, radiation heat transfer, and miner room ventilation. Includes over 2.5 hours of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For cooling at the component level, with heat sinks, IGBT modules, microchannels, and immersion cooling, see the Chip & Component: Electronics Cooling All Levels Training Package.
Chip & Component: Electronics Cooling Training Package
Beginner, Intermediate, Advanced
Price: $179
The Chip & Component: Electronics Cooling All Levels Training Package is a focused 7-project path for cooling electronic components, from basic heat sinks and IGBT power modules to microchannel and immersion cooling. It delivers hands-on ANSYS Fluent training for students, engineers, and researchers, covering heat sink cooling, IGBT power modules, microchannel heat sinks with conjugate heat transfer, pin and plate heat sink comparison, and PCB and heat sink immersion cooling. Includes nearly 2 hours of step-by-step video lessons with English audio, and 15 years of MR CFD expertise. For heat sink design in greater depth, with porous media, nanofluids, and optimization, see the Heat Sink: Electronics Cooling All Levels Training Package.
Heat Sink: Electronics Cooling Training Package
Beginner, Intermediate, Advanced
Price: $289
The Heat Sink: Electronics Cooling All Levels Training Package delivers 10 hands-on ANSYS Fluent projects, taking students, engineers, and researchers from basic heat sink cooling to advanced thermal management. It covers forced convection cooling, IGBT power electronics, porous media and non-equilibrium aluminum foam with paper validation, microchannel heat sinks with conjugate heat transfer and DOE optimization, immersion cooling, water-based nanofluids (TiO₂, SiO₂, Fe₃O₄), and pin and plate heat sink comparison. Includes nearly 3 hours of step-by-step video lessons, English audio with subtitles in six languages, and 15 years of MR CFD expertise for a confident start in electronics cooling CFD.
The Electronic Cooling GOLDEN Training Package is MR CFD’s most complete ANSYS Fluent collection for thermal management of electronics, with over 40 hands-on tutorials that take you from a first heat sink model to advanced, publication-level analysis. Built for professors, CEOs, research teams, and engineering firms, it gives your group a ready-to-use project library, so new members become productive quickly and ongoing work starts from proven templates.
Heat sinks and chip cooling: Simulate basic heat sink cooling, an IGBT heat sink, and a CPU with silicone thermal paste. Study the impact of geometry, splitter plates on pin fin heat sinks, and pin and plate heat sink comparison. Add a porous-medium heat sink, a non-equilibrium porous aluminum foam heat sink with paper validation, and heat sink cooling with water and TiO₂, SiO₂, and Fe₃O₄ nanofluids.
Microchannel cooling: Analyze heat transfer enhancement and conjugate heat transfer in microchannel heat sinks, a microchannel heat source, multiphase nanofluid flow in a minichannel, and two-phase flow boiling of methanol in a heated micro-channel. Optimize a microchannel heat sink with Design of Experiments (DOE) using the Latin Hypercube Sampling Design (LHSD) method.
Immersion cooling and heat pipes: Model submerge cooling of a printed circuit board (PCB), the effect of immersion cooling on heat sink performance, and liquid immersion cooling of an ASIC miner. Simulate a thermosyphon heat pipe with the VOF multiphase model, and evaporation and condensation in a heat pipe.
Battery thermal management: Study battery cooling with PCM, nanofluid, and water vapor. Model battery modules with cooling channels and a cooling plate, and a battery pack with a cold plate. Work through a 1P1S battery with a PCM cover and a lithium-ion battery cooled with PCM, both validated against papers.
Data centers, server and computer rooms: Reproduce a data center thermal performance study with paper validation, and model data center HVAC and thermal management, data center cooling, and a server room with 6 cabinets. Add computer room air conditioning with DPM, radiation heat transfer in a computer room, and miner room ventilation.
Generator and machinery rooms: Simulate generator room ventilation in an industrial application and with fans, transformer room ventilation, and storage container room ventilation. Evaluate the impact of ventilation on temperature and humidity in a turbine hall, and the ventilation system of a ship engine room.
What’s included:
Step-by-step exercises with complete setup, meshing, solving, and post-processing
Projects spanning beginner, intermediate, and advanced levels, including paper-validation cases
1-year technical support
3-month HPC access
Lifetime updates
Backed by 15 years of MR CFD simulation expertise
Whether you’re preparing a research paper, designing cooling for chips, batteries, or data centers, or building in-house CFD capability, this package gives you the knowledge, tools, and confidence to deliver faster and stay ahead of the competition.